logo.gif (21062 octets)

 

  DSMI Electronics SA

Request / Informations diverses :
 a.bolis@dsmielectronics.com
Sales / Ventes :
 sales@dsmielectronics.com
HOME PRODUCT  SALE

DSMI Electronics SA (DSMI) acquires Precicontact SA assets

All the standard products are available as ROHS compliant and as non ROHS upon request

[left.htm]

                           

BALL GRID ARRAY SOCKETS

 

bga-photo.jpg (48617 octets)  

  PRECICONTACT INNOVATIONS

  Ultra low floating pin.

  Progressive Insertion.

  Low insertion force.

  Optional : Wave soldering for socket.

  Optional : No floating pin.

  Optional : Kapton for BGA adapter

 

bga-croq.gif (9692 octets)

ROWS

A ( MM.)

A ( Inches )

ROWS

A ( MM.)

A ( Inches )

7

*

7

11.43

4.50

21

*

21

29.21

11.50

8

*

8

12.70

5.00

22

*

22

30.48

12.00

9

*

9

13.97

5.50

23

*

23

31.75

12.50

10

*

10

15.24

6.00

24

*

24

33.02

13.00

11

*

11

16.51

6.50

25

*

25

34.29

13.50

12

*

12

17.78

7.00

26

*

26

35.56

14.00

13

*

13

19.05

7.50

27

*

27

36.83

14.50

14

*

14

20.32

8.00

28

*

28

38.10

15.00

15

*

15

21.59

8.50

29

*

29

39.37

15.50

16

*

16

22.86

9.00

30

*

30

40.64

16.00

17

*

17

24.13

9.50

31

*

31

41.91

16.50

18

*

18

25.40

10.00

32

*

32

43.18

17.00

19

*

19

26.67

10.50

33

*

33

44.45

17.50

20

*

20

27.94

11.00

34

*

34

45.72

18.00

 

pinbga.gif (2096 octets) Floating pin : 1.065 mm.

No floating pin : 0.720 mm.

 

 

 

Standard ordering :

Part Reference Example Details
BGA BALL SOCKET : BGA-XX-Y-4-S-2 BGA-2020-272-4S-2 Floating pins
BGA BALL SOCKET : BGAM-XX-Y-4-S-2 BGAM-2020-272-4S-2 No floating pins
BGA PIN SOCKET : BGA-XX-Y-4-F-2 BGA-2020-272-4F-2 Socket for wave soldering
BGA ADAPTER : BGA-XX-Y-1-A BGA-2020-272-1-A Floating pins
BGA ADAPTER : BGA-XX-Y-1-K BGA-2020-272-1-K No floating pins

Rows : XX.

Number of pins : Y.

 

Standard Requirements :

Insulator : Glass-filled Epoxy, FR5, Rated to UL94V-0.

Pin male : Gold 5 µ" (0.13 µm).

Pin female : Tin  150 µ (3.80 µm).

Inner contact : Gold 10 µ" (0.25 µm).

Performance specifications :

Insertion force - 35g per contact and progressive insertion.

Withdrawal force - 15g per contact.

Soldering : solder cream,stencil printer or dispensing, and I.R. furnace.

Maximum Operating Current - 1 Ampere per contact.

Minimum Durability - 50 cycles.

Operating Temperature - 65°C to 125°C.

Others :

Grid : .050 " ( 1.27 mm) or (1.5 mm).

For specific socket specifications consult the factory.

All BGA footprints available.

Quick delivery available.

 

MORE INFORMATION ? PLEASE CONTACT OUR FACTORY.