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  DSMI Electronics SA

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HOME PRODUCT  SALE

DSMI Electronics SA (DSMI) acquires Precicontact SA assets

All the standard products are available as ROHS compliant and as non ROHS upon request

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IX / IXP

Interstitial Pin Grid Array Socket and Adapter ( Glass Epoxy and Molded Plastic Insulator )

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bullet.100 (2.54) staggered Pin-Grid-Array sockets.
bulletAvailable for the most  popular devices.
bulletSockets are molded in hi-temp LCP material and are surface mount compatible.
bulletScrew machine contacts feature low insertion and withdrawal force inner contact.
bulletCustom footprints and Glass-epoxy insulators available (consult the factory).

 

FIG 1 Soldertail A

FIG 2 Surface Mount

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ORDERING INFORMATION

 

U

IX

I

P

37

320

TL

A

72

Type

Series

Style

Insulator

Grid Size

Number of pins

Plating of Sleeve

* Terminal Style

Plating of Inner Contact

U - Open Insulator

SMT

Molded Plastic

Footprint

GH - GoId 10µ" (0.25µm)

See Figure 1 and 2

70 - Gold 10µ" (0.25µm)

(Leave Blank for Closed Insulator)

Leave blank for Glass Epoxy

TL - Tin Lead 200µ" (5.08µm)

Soldertail Fig 1

72 - GoId 30µ" (0.75µm)

TB -Tin Bright (SMT)               150µ"( 3.80µm)

A - .090 (2.29)…90231

74 - Tin  200µ" (5.08µm)
TF - Tin  200µ" (5.08µm)

B - .120 (3.05)…90238

74F - Tin  200µ" (5.08µm) with lubricant

SMT pins Fig 2

**22 - GoId 10µ" (0.25µm)
A - ….          …....90232

**23 - Gold 30µ" (0.75µm)

* Terminal Style :

For Multilayer PCB with thickness more than 1.6 mm use Soldertail B

For Soldertail B : 090 (2.29) just become .120 (3.05) on Fig 1

 

Performance Specifications :

Minimum Durability - 50 cycles

With .0180 (0.457)Æ Spherical Radius Pin :

Insertion Force - 43g per contact

Withdrawal Force - 23g per contact

**Special Ultra Low Insertion Force Clip

**Insertion Force - 22g per contact

**Withdrawal Force - 10g per contact

Maximum Operating Current - 1 Ampere per Contact

Dielectric Withstanding Voltage - 1000V RMS for 1 Minute

Minimum Insulation Resistance - 5000 Megohms

Pin-to-Pin Capacitance - <0.4pf

Contact Resistance - <20mW

 

  

Specifications :

Inner Contact - BeCu per QQ-C-533

Outer Sleeve - Brass per QQ-B-626

Insulator (Molded) - Liquid Crystal Polymer (LCP) Rated to UL94V-O, color black

Insulator - (Glass Epoxy) – G-10, FR-4, Rated to UL94V-O

Operating Temperature - -650 C to + 1250 C

Soldering - lnfared Reflow: 2300 C, duration 15 seconds (2600 C max.)

All Platings - Over 50µ" (1.27µm) Nickel over 5µ" (0.13µm) minimum Copper

IC Pin Dimension Range - .016 (.041) to .025 (.063) round, .125 (3.18) minimum length