DSMI Electronics SA (DSMI) acquires Precicontact SA assets
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ISO Shrink-Dip Socket .70 (1.78) Pitch
ORDERING INFORMATION
Specifications: Inner Contact - BeCu per QQ-C-533 Outer Sleeve - Brass per QQ-B-626 Insulator - Glass Epoxy, G-10, FR-4 Rated to UL94V-O Operating Temperature - -650C to +1250C Soldering - Wave soldering only (1 750C for 15 seconds) PCB Thickness - .062 (1.57) to .125 (3.18) PCB Hole Size - .035 +/- .003 (0.89 +/- 0.08) solder termination All Platings - Over 50 µ" (1.27 µm) minimum Nickel over 5 µ" (013 µm) minimum Copper
Insertion Force - 186 grams Withdrawal Force - 92 grams Other : Customs available. |