logo.gif (21062 octets)

 

  DSMI Electronics SA

Request / Informations diverses :
 a.bolis@dsmielectronics.com
Sales / Ventes :
 sales@dsmielectronics.com
HOME PRODUCT  SALE

DSMI Electronics SA (DSMI) acquires Precicontact SA assets

All the standard products are available as ROHS compliant and as non ROHS upon request

[left.htm]

 

UXP

Molded Pin Grid Array Socket and Adapter

uxp-30.jpg (207605 octets)
bulletAvailable for the most popular devices.
bulletSockets are molded in Hi-temp PPS material and are surface mount compatible.
bulletScrew machine contacts feature low insertion and withdrawal force inner clips.
bulletOptions include: molded stand-offs, wire-wrap®, soldertail, adaptor, surface-mount and low-profile termination options.

 

Table 1           C : Adapter Terminal Options

FIG 1

FIG.2

usc-95-1.jpg (27736 octets)

usc-95-2.jpg (27562 octets)

PIN TYPE

FIG

A

B

C

D

E

LOOSE PIN NUMBER

FAA

1

.154 (3.92)

.156 (3.95)

.165 (4.20)

.475 (12.07)

.024 (0.62)

3050

FBB

1

.154 (3.92)

.156 (3.95)

.124 (3.15)

.434 (11.02)

.019 (0.48)

3168

FCC

1

.119 (3.02)

.156 (3.95)

.165 (4.20)

.440 (11.17)

.024 (0.62)

3155

FDD

1

.533 (14.05)

.156 (3.95)

.177 (4.50)

.886 (22.50)

.030 (0.76)

3158

BEE

1

.120 (3.05)

.156 (3.55)

.093 (2.35)

.352 (8.94)

.020 (0.50)

3093

BFF

1

.120 (3.05)

.156 (3.55)

.262 (6.66)

.522 (13.26)

.020 (0.50)

3094

AGG

1

.187 (4.75)

.156 (3.95)

.165 (4.20)

.476 (12.10)

.024 (0.62)

3009

FZZ

1

.154 (3.92)

.125 (3.18)

.165 (4.20)

.475 (12.07)

.019 (0.48)

3137

DKK

2

.335 (8.51)

.125 (3.18)

.125 (3.18)

.585 (14.86)

.019 (0.48)

80152

 

Style : Leave blank

Style : W

ux-28-1.jpg (48249 octets)

 

See PINS

2 - E=.360 (9.15) . . . . . ..3001-2

3 -E= .500 (12.70) . . . . ..3001-3

Style : I

Style : L

ux-28-4.jpg (34330 octets)

ux-28-5.jpg (36278 octets)

 

ORDERING INFORMATION

 

 

U

A

X

C

P

14

132

TL

A

72

Type

Alternate Footprint

Style

Grid Size

Number of Pins

Plating of Sleeve

Terminal Style

Plating of Inner Contact Blank if adapter

U - Open Insulator

Leave Blank for Soldertail

Footprint

GH - Gold 10µ" (0.25µm)

A   or          See Table 1

70 - GoId 10µ" (0.25µm)

(Leave Blank for Closed Insulator)

C - Adaptor

TL - Tin Lead 200µ" (5.08µm)

72 - GoId 30µ" (0.75µm)

I - SMT

TB - Tin Lead 180µ" (3.80µm) 74 - Tin  200µ" (5.08µm)

L - Low-Profile

TF - Tin  200µ" (5.08µm)

74F - Tin  200µ" (5.08µm) with lubricant

W - Wire-Wrap®

**22 - Gold 10µ" (0.25µm)
**23 - GoId 30µ" (0.75µm)

 

 

Performance Specifications:

Minimum Duability - 50 cycles

Insertion Force - 43g per contact*

Withdrawal Force - 23g per contact*

**Insertion Force - 22g per contact*

**Withdrawal Force - 10g per contact*

Maximum Operating Current - 1 Ampere per contact

Dielectric Withstanding Voltage - 1000V RMS for 1 Minute

Minimum Insulation Resistance - 5000 megohms

Pin-to-Pin Capacitance - <0.4pf

Contact Resistance - <0.4mW

*With .0180 (0.457) Æ Spherical Radius Pin

**Special Ultra Low Insertion Force Clip

 uxp-31.jpg (46915 octets)

 

Specifications:

Inner Contact - BeCu per QQ-C-533

Outer Sleeve - Brass per QQ-B-626

Insulator – PPS (Ryton TM), Polyphenylene Sulfide Rated to UL94V-O

Operating Temperature - -650C to + 1250C

All Platings - Over 50µ" (1.27µm) Nickel over 5µ" (0.13µm) Copper

Soldering - Infared reflow: 2300C, duration 15 seconds (2600 C max)

IC Pin Dimension Range - .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length